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Electronics Design Tools, Calculators & Guides

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ETSI Events:  ETSI Security Conference 2026NIST – Standards news feed:  2070 Balance and Scale Calibration and UncertaintiesETSI Events:  ETSI/IQC Quantum Safe Cryptography Conference 2026ETSI Events:  10th MCX PLUGTESTSETSI Events:  Electronic Attestation of Attributes (EAA) Plugtests ETSI Events:  FutureNet World 2026ETSI Events:  12th UCAAT - User Conference on Advanced Automated TestingNIST – Standards news feed:  Technologies and Use Cases for Smart StandardsETSI Events:  CSC Cybersecurity Standardisation Conference 2026ETSI Events:  MWC 2026ISO/IEC JTC1/SC7:  ISO/IEC/IEEE DIS 15026-4 - Systems and software engineering — Systems and software assurance — Part 4: Assurance in the life cycleMicrowave Journal – Industry News feed:  DOCOMO Demonstrates World’s First Stable Robot Teleoperation Over Commercial 5G with Keio UniversityMicrowave Journal – Aerospace & Defense channel:  Airbus Defence and Space and Greenerwave Strengthen Their Strategic Partnership in Satcom Through Two New ContractsEuropean Commission – Harmonised Standards (EMC and others):  Commission Implementing Decision (EU) 2026/375 of 20 February 2026 on harmonised standards drafted in support of Regulation (EC) No 765/2008 setting out the requirements for accreditation - OJ L, 2026/375, 23.2.2026Microwave Journal – Industry News feed:  Rohde & Schwarz and LITEON Demonstrate High‑throughput 5G Femtocell Testing with the PVT360AMicrowave Journal – Industry News feed:  Amphenol Printed Circuits Shows PCBs for Quantum Computing at 2026 APSNIST – Standards news feed:  SRM Story: SRMs 3672a and 3673a Organic Contaminants in Smokers’ and Nonsmokers’ UrineIEEE Standards Association:  Age-Appropriate Design and Child Digital Well-Being: Key Takeaways from the WSIS+20 Side EventISO/IEC JTC1/SC7:  ISO/IEC FDIS 29110-5-1-4 - Systems and software engineering — Life cycle profiles for very small entities (VSEs) — Part 5-1-4: Software engineering guidelines for the generic Advanced profileISO/IEC JTC1/SC7:  ISO/IEC FDIS 29110-5-3 - Systems and software engineering — Life cycle profiles for very small entities (VSEs) — Part 5-3: Service delivery guidelinesISO/IEC JTC1/SC7:  ISO/IEC FDIS 29110-5-6-1 - Systems and software engineering — Life cycle profiles for very small entities (VSEs) — Part 5-6-1: System engineering guidelines for the generic Entry profileMicrowave Journal – Industry News feed:  Samtec Interconnects Selected for VITA 90 VNX+Microwave Journal – Industry News feed:  Amphenol RF Introduces 2.92 mm Connectors for 0.141 in. Conformable CableMicrowave Journal – Industry News feed:  Molex Sets New Benchmark for AI and 6G Testing with 145 GHz Cardinal Multi-Port High Frequency Coaxial AssembliesMicrowave Journal – Industry News feed:  Microwave Transmission Equipment Market Flattens Out in 2025Microwave Journal – Aerospace & Defense channel:  Global Invacom Group Launches Rapid Deploy XY Antenna Range for Mission‑Critical, Multi‑Orbit ConnectivityMicrowave Journal – Industry News feed:  Rohde & Schwarz Advances AI-RAN Testing Using Digital Twins with NVIDIAMicrowave Journal – Industry News feed:  AntennaWare and SynchronicIT Collaborate to Offer Significant Improvements in UWB ApplicationsETSI Events:  CRA Standards Unlocked - EU Tour ISO/IEC JTC1/SC7:  ISO/IEC FDIS 29110-5-1-3 - Systems and software engineering — Life cycle profiles for very small entities (VSEs) — Part 5-1-3: Software engineering guidelines for the generic Intermediate profileISO/IEC JTC1/SC7:  ISO/IEC DIS 29110-5-6-3 - Systems and software engineering — Life cycle profiles for very small entities (VSEs) — Part 5-6-3: System engineering guidelines for the generic Intermediate profileISO/IEC JTC1/SC7:  ISO/IEC FDIS 29110-5-6-2 - Systems and software engineering — Life cycle profiles for very small entities (VSEs) — Part 5-6-2: System engineering guidelines for the generic Basic profileEASA – News feed:  New vacancy published: IT Service Manager - AnalyticsMicrowave Journal – Aerospace & Defense channel:  Skynopy and Safran Space Win the SkyConnect Kenya Project to Digitize and Accelerate the Commercialization of an Antenna in KenyaMicrowave Journal – Industry News feed:  Taara Unveils Taara Photonics and Taara BeamMicrowave Journal – Industry News feed:  Compound Semiconductors Enter a New Growth Phrase Powered by AI & ElectrificationMicrowave Journal – Industry News feed:  High Speed Data Acquisition for Advanced Applications: The ADQ35 DigitizerMicrowave Journal – Industry News feed:  Socionext and Innatera Introduce Integrated 60 GHz FMCW Radar and Neuromorphic Edge AI for Human Presence DetectionMicrowave Journal – Industry News feed:  Rohde & Schwarz and Broadcom Showcase First Wi-Fi 8 RF Signaling Tests, Paving Way for Next-gen Connectivity EASA – News feed:  EASA publishes briefing note on sustainable aviation fuels (SAF) prices in 2025 in the European UnionMicrowave Journal – Industry News feed:  WBA Publishes Industry First Guidance on AI and ML for Intelligent Wi-FiMicrowave Journal – Industry News feed:  Keysight Introduces Infiniium XR8 Oscilloscopes to Accelerate High Speed Digital Validation and ComplianceMicrowave Journal – Aerospace & Defense channel:  Teledyne HiRel Semiconductors Unveils Industry’s Lowest Power, 4 GHz, Wideband LNAMicrowave Journal – Industry News feed:  Z-Communications, Inc Releases CRO6000X2-LFEASA – News feed:  New EASA Service Portal launched to support Organisation Approvals and Part-IS ApplicationsMicrowave Journal – Industry News feed:  AntennaWare Launches an Array of New Products to Address Complex Wireless Applications at embedded worldIETF Blog:  The current state of RDAPMicrowave Journal – Industry News feed:  Rohde & Schwarz Highlights its Unique CMX500 One-box Tester Tailored for NTN Testing at MWC Barcelona 2026NIST – Standards news feed:  New Report: Expanding the AI Evaluation Toolbox with Statistical ModelsNIST – Standards news feed:  Release of RM 8043 - Forensic DNA Resource MaterialsETSI Events:  ETSI Security Conference 2026NIST – Standards news feed:  2070 Balance and Scale Calibration and UncertaintiesETSI Events:  ETSI/IQC Quantum Safe Cryptography Conference 2026ETSI Events:  10th MCX PLUGTESTSETSI Events:  Electronic Attestation of Attributes (EAA) Plugtests ETSI Events:  FutureNet World 2026ETSI Events:  12th UCAAT - User Conference on Advanced Automated TestingNIST – Standards news feed:  Technologies and Use Cases for Smart StandardsETSI Events:  CSC Cybersecurity Standardisation Conference 2026ETSI Events:  MWC 2026ISO/IEC JTC1/SC7:  ISO/IEC/IEEE DIS 15026-4 - Systems and software engineering — Systems and software assurance — Part 4: Assurance in the life cycleMicrowave Journal – Industry News feed:  DOCOMO Demonstrates World’s First Stable Robot Teleoperation Over Commercial 5G with Keio UniversityMicrowave Journal – Aerospace & Defense channel:  Airbus Defence and Space and Greenerwave Strengthen Their Strategic Partnership in Satcom Through Two New ContractsEuropean Commission – Harmonised Standards (EMC and others):  Commission Implementing Decision (EU) 2026/375 of 20 February 2026 on harmonised standards drafted in support of Regulation (EC) No 765/2008 setting out the requirements for accreditation - OJ L, 2026/375, 23.2.2026Microwave Journal – Industry News feed:  Rohde & Schwarz and LITEON Demonstrate High‑throughput 5G Femtocell Testing with the PVT360AMicrowave Journal – Industry News feed:  Amphenol Printed Circuits Shows PCBs for Quantum Computing at 2026 APSNIST – Standards news feed:  SRM Story: SRMs 3672a and 3673a Organic Contaminants in Smokers’ and Nonsmokers’ UrineIEEE Standards Association:  Age-Appropriate Design and Child Digital Well-Being: Key Takeaways from the WSIS+20 Side EventISO/IEC JTC1/SC7:  ISO/IEC FDIS 29110-5-1-4 - Systems and software engineering — Life cycle profiles for very small entities (VSEs) — Part 5-1-4: Software engineering guidelines for the generic Advanced profileISO/IEC JTC1/SC7:  ISO/IEC FDIS 29110-5-3 - Systems and software engineering — Life cycle profiles for very small entities (VSEs) — Part 5-3: Service delivery guidelinesISO/IEC JTC1/SC7:  ISO/IEC FDIS 29110-5-6-1 - Systems and software engineering — Life cycle profiles for very small entities (VSEs) — Part 5-6-1: System engineering guidelines for the generic Entry profileMicrowave Journal – Industry News feed:  Samtec Interconnects Selected for VITA 90 VNX+Microwave Journal – Industry News feed:  Amphenol RF Introduces 2.92 mm Connectors for 0.141 in. Conformable CableMicrowave Journal – Industry News feed:  Molex Sets New Benchmark for AI and 6G Testing with 145 GHz Cardinal Multi-Port High Frequency Coaxial AssembliesMicrowave Journal – Industry News feed:  Microwave Transmission Equipment Market Flattens Out in 2025Microwave Journal – Aerospace & Defense channel:  Global Invacom Group Launches Rapid Deploy XY Antenna Range for Mission‑Critical, Multi‑Orbit ConnectivityMicrowave Journal – Industry News feed:  Rohde & Schwarz Advances AI-RAN Testing Using Digital Twins with NVIDIAMicrowave Journal – Industry News feed:  AntennaWare and SynchronicIT Collaborate to Offer Significant Improvements in UWB ApplicationsETSI Events:  CRA Standards Unlocked - EU Tour ISO/IEC JTC1/SC7:  ISO/IEC FDIS 29110-5-1-3 - Systems and software engineering — Life cycle profiles for very small entities (VSEs) — Part 5-1-3: Software engineering guidelines for the generic Intermediate profileISO/IEC JTC1/SC7:  ISO/IEC DIS 29110-5-6-3 - Systems and software engineering — Life cycle profiles for very small entities (VSEs) — Part 5-6-3: System engineering guidelines for the generic Intermediate profileISO/IEC JTC1/SC7:  ISO/IEC FDIS 29110-5-6-2 - Systems and software engineering — Life cycle profiles for very small entities (VSEs) — Part 5-6-2: System engineering guidelines for the generic Basic profileEASA – News feed:  New vacancy published: IT Service Manager - AnalyticsMicrowave Journal – Aerospace & Defense channel:  Skynopy and Safran Space Win the SkyConnect Kenya Project to Digitize and Accelerate the Commercialization of an Antenna in KenyaMicrowave Journal – Industry News feed:  Taara Unveils Taara Photonics and Taara BeamMicrowave Journal – Industry News feed:  Compound Semiconductors Enter a New Growth Phrase Powered by AI & ElectrificationMicrowave Journal – Industry News feed:  High Speed Data Acquisition for Advanced Applications: The ADQ35 DigitizerMicrowave Journal – Industry News feed:  Socionext and Innatera Introduce Integrated 60 GHz FMCW Radar and Neuromorphic Edge AI for Human Presence DetectionMicrowave Journal – Industry News feed:  Rohde & Schwarz and Broadcom Showcase First Wi-Fi 8 RF Signaling Tests, Paving Way for Next-gen Connectivity EASA – News feed:  EASA publishes briefing note on sustainable aviation fuels (SAF) prices in 2025 in the European UnionMicrowave Journal – Industry News feed:  WBA Publishes Industry First Guidance on AI and ML for Intelligent Wi-FiMicrowave Journal – Industry News feed:  Keysight Introduces Infiniium XR8 Oscilloscopes to Accelerate High Speed Digital Validation and ComplianceMicrowave Journal – Aerospace & Defense channel:  Teledyne HiRel Semiconductors Unveils Industry’s Lowest Power, 4 GHz, Wideband LNAMicrowave Journal – Industry News feed:  Z-Communications, Inc Releases CRO6000X2-LFEASA – News feed:  New EASA Service Portal launched to support Organisation Approvals and Part-IS ApplicationsMicrowave Journal – Industry News feed:  AntennaWare Launches an Array of New Products to Address Complex Wireless Applications at embedded worldIETF Blog:  The current state of RDAPMicrowave Journal – Industry News feed:  Rohde & Schwarz Highlights its Unique CMX500 One-box Tester Tailored for NTN Testing at MWC Barcelona 2026NIST – Standards news feed:  New Report: Expanding the AI Evaluation Toolbox with Statistical ModelsNIST – Standards news feed:  Release of RM 8043 - Forensic DNA Resource Materials

Explore by Category

HID Report Descriptor Visualizer & Builder (USB HID Tool)

Paste hex or C arrays to decode HID report descriptors, then edit visually and export HEX, C, TinyUSB, or STM32 snippets. Includes ready-made keyboard, mouse, gamepad, and media-key templates with live explanations.

Feb 3, 2026

Voltage Divider Calculator (Loading, Power, ADC & Logic Level Use Cases)

Best-in-class voltage divider calculator: Vout, current, resistor power, optional load (Rload), ADC input sizing tips, and practical guidance for UART/I²C/logic level shifting.

Feb 1, 2026

Active Filter Designer (Sallen-Key + Bode Plot)

Design practical Sallen-Key active low-pass and high-pass filters: quick sizing from f0 or from fp/fs specs (Butterworth / Chebyshev I), E-series rounding, op-amp sanity checks, Bode/step plots, and SPICE export.

Jan 14, 2026

Cortex-M HardFault Decoder (CFSR / HFSR / BFAR / MMFAR + Stack Frame)

Advanced Cortex-M HardFault decoder. Analyze CFSR, HFSR, BFAR, MMFAR + stack frame (PC/LR/xPSR). Works great with STM32, nRF, NXP and more.

Jan 14, 2026

Buck / Boost Designer (Inductor + Caps + Audit)

First-pass sizing for buck and boost converters: pick ripple targets, get L/C starting points, sanity-check a chosen BOM, explore worst-case corners, and export a review-ready summary.

Dec 20, 2025

RS-485 / CAN Termination & Bias Planner

Size RS-485 fail-safe bias resistors, sanity-check termination loading, and get practical CAN termination values (classic + split) with quick notes.

Dec 18, 2025

Battery Burst Droop Estimator (Brownout Margin + Hold-up Caps)

Estimate VBAT sag during a peak current burst (I*R + ESR step + RC droop). Size hold-up caps and check brownout margin.

Dec 16, 2025

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Browse the full collection of design tools and calculators.

I3C Bus Explained: A Modern Sensor Bus (and the Successor to I2C)

An engineering-focused introduction to the MIPI I3C bus. Learn why I3C exists, how it stays compatible with I2C, how dynamic addressing (DAA) works, what Common Command Codes (CCC) are, and how features like in-band interrupts (IBI) simplify sensor designs.

Feb 3, 2026

UART Serial Communication Explained: Framing, Timing, and Hardware Design

A practical, engineering-focused guide to the Universal Asynchronous Receiver/Transmitter (UART). Covers wiring (TX/RX), frame structure (8N1, parity, stop bits), baud-rate math and clock error budget, hardware/software flow control (RTS/CTS, XON/XOFF), logic-level vs. RS-232/RS-485 electrical layers, and PCB/layout tips for reliable serial links.

Jan 30, 2026

High-Speed PCB Routing Cheat Sheet (Edge-Rate Based)

A practical, edge-rate based checklist for routing fast digital signals: when a trace becomes a transmission line, return paths, termination, differential pairs, vias, and crosstalk.

Dec 15, 2025

Thermal Vias & Copper Spreading (PCB Heat Transfer Guide + Estimator)

Design thermal vias that actually work: what matters (via count, plating, board thickness, fill), how copper spreading limits performance, and a simple estimator to sanity-check your layout.

Dec 15, 2025

USB-C Power Delivery Hardware Design (Sink, Source, DRP)

Practical USB-C PD hardware design guide: CC pins, Rp/Rd basics, PD vs resistor-only, PPS/EPR overview, protection, layout, and bring-up checklists.

Dec 12, 2025

The Complete Guide to DMA (Direct Memory Access) for Microcontrollers

A practical, in-depth guide to mastering DMA on microcontrollers. From theory to hands-on examples on STM32, learn how to free your CPU and optimize your embedded applications.

Oct 14, 2025

How to wire a reliable 1 m I²C sensor

Step-by-step workflow to control capacitance, size pull-up resistors, document a harness and validate the waveforms for a long I²C run.

Sep 24, 2025

View All 15 Guides

Explore all available guides and learning resources.