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Electronics Design Tools, Calculators & Guides

Hub for electronics design knowledge and tools.

Practical guides, clear reference tables, and essential utilities. Straight to the point – for and by electronics enthusiasts.

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NIST – Standards news feed:  2070 Balance and Scale Calibration and UncertaintiesETSI Events:  ETSI/IQC Quantum Safe Cryptography Conference 2026ETSI Events:  12th UCAAT - User Conference on Advanced Automated TestingETSI Events:  ETSI AI and Data Conference 2026ETSI Events:  Software & Standards for Smart Networks & Services 2026ETSI Events:  BodyNets2025ETSI Events:  TFS#8 HackfestETSI Events:  5th mWT Plugtests ETSI Events:  ETSI eHEALTH Open Session - "Let’s talk about health and the role of standards for the technology”ETSI Events:  ETSI F5G Open Session on "F6G: Defining the Foundations of the Next Optical Network Generation"ETSI Events:  ESTIMED Hackathon #1 - Enabling innovative IoT-edge use cases through standardization, open-source technology, and collaboration ETSI Events:  ISAC Channel Modelling: A stepping stone in the journey to ISAC standardisationETSI Events:  5th FRMCS PlugtestsISO/IEC JTC1/SC7:  ISO/IEC/IEEE FDIS 24748-4 - Systems and software engineering — Life cycle management — Part 4: Systems engineering management planningISO/IEC JTC1/SC7:  ISO/IEC/IEEE FDIS 24748-10 - Systems and software engineering — Life cycle management — Part 10: Guidelines for systems engineering agilityISO/IEC JTC1/SC7:  ISO/IEC/IEEE FDIS 24748-7 - Systems and software engineering — Life cycle management — Part 7: Application of systems engineering on defence programsMicrowave Journal – Aerospace & Defense channel:  ALL.SPACE Awarded €950,000 by ESA’s NAVISP ProgrammeIEEE Standards Association:  Revolutionizing Sports: The New Era of Athlete Health and Performance TrackingEASA – News feed:  EASA and ECHA strengthen cooperation with updated MoC agreementIETF Blog:  New IETF Note WellMicrowave Journal – Industry News feed:  Glass Core Substrates and Glass Interposers: New Growth Engines for Glass in Advanced Packaging for AI and HPCMicrowave Journal – Industry News feed:  New IDTechEx Report Analyzes What 6G will Bring to the World of TelecomsMicrowave Journal – Aerospace & Defense channel:  Rohde & Schwarz and TRUMPF Cooperate in Drone DefenseMicrowave Journal – Industry News feed:  Qorvo Simplifies Sub-1GHz RF Design with Wideband, High-Efficiency Power AmplifierEASA – News feed:  EASA publishes report on Sustainable Aviation Fuel scale-up, progress and pressure pointsMicrowave Journal – Industry News feed:  Signal Hound Releases the PCR4200 4-Channel Phase Coherent Receiver Now in Stock and Available to OrderMIPI Alliance:  Reimagining Embedded Audio: MIPI SWI3S Is a Game ChangerETSI Events:  OpenSlice Release 2025Q2 WebinarMicrowave Journal – Industry News feed:  New MEMS-based MultiGBASE-T1 FIUs from Pickering Ramp up Test System Bandwidth, Throughput & Operational LifeMicrowave Journal – Aerospace & Defense channel:  NXGSAT Secures €1.2M Seed Funding to Accelerate Launch of its High Speed 5G Satellite ModemISO/IEC JTC1/SC7:  ISO/IEC TS 33064:2025 - Information technology — Process assessment — Process assessment model for safety processesISO/IEC JTC1/SC7:  ISO/IEC TS 15504-10:2011 - Information technology — Process assessment — Part 10: Safety extensionEASA – News feed:  New deadline: EASA Certification Director vacancy now open until October 28Microwave Journal – Industry News feed:  Keysight Completes Acquisition of Synopsys’ Optical Solutions Group and Ansys’ PowerArtistMicrowave Journal – Industry News feed:  Indium Introduces 2026 DIY Internship Program to Empower Next-Gen Industry LeadersMicrowave Journal – Aerospace & Defense channel:  Anduril Demonstrates and Delivers C-UAS Capabilities to USNORTHCOM at Falcon Peak 25.2Microwave Journal – Aerospace & Defense channel:  Teledyne e2v Achieves Initial Qualification of 16 GB Space DDR4 MemoryMicrowave Journal – Industry News feed:  Molex Announces Agreement to Acquire Smiths InterconnectISO/IEC JTC1/SC7:  ISO/IEC 29110-5-2-1 - Systems and software engineering — Life cycle profiles for very small entities (VSEs) — Part 5-2-1: Organizational management guidelinesMicrowave Journal – Industry News feed:  Broadcom Introduces Industry’s First 800G AI Ethernet NICMicrowave Journal – Industry News feed:  Wireless Startup Movandi Secures $40M for Next-Gen Intelligent Connectivity; Opens New Office in OmanIEEE Standards Association:  How Good Is The Camera? IEEE 4001™ Gives AnswersMicrowave Journal – RFID/GPS/UWB/Location channel:  Sateliot Launches a Project with the ESA to Break GPS Dependency and Open its Satellite IoT to DefenseIETF Blog:  Previewing the updated RFC-Editor.org website at IETF 124 MontrealBluetooth SIG:  Bluetooth HVAC integration will drive commercial scalability, reduce costs, and improve operational performanceMicrowave Journal – Industry News feed:  MatrixSpace Completes $20M Series B FundingMicrowave Journal – Industry News feed:  The 2026 IEEE/JSAP Symposium on VLSI Technology & Circuits Announces Call for PapersMicrowave Journal – Industry News feed:  DDS Technology Enables Microwave Ion Control for Quantum ComputingMicrowave Journal – Industry News feed:  Rohde & Schwarz Unveils Compact MXO 3 Oscilloscopes with Four and Eight ChannelsISO/IEC JTC1/SC7:  ISO/IEC TS 30103:2015 - Software and Systems Engineering — Lifecycle Processes — Framework for Product Quality AchievementNIST – Standards news feed:  2070 Balance and Scale Calibration and UncertaintiesETSI Events:  ETSI/IQC Quantum Safe Cryptography Conference 2026ETSI Events:  12th UCAAT - User Conference on Advanced Automated TestingETSI Events:  ETSI AI and Data Conference 2026ETSI Events:  Software & Standards for Smart Networks & Services 2026ETSI Events:  BodyNets2025ETSI Events:  TFS#8 HackfestETSI Events:  5th mWT Plugtests ETSI Events:  ETSI eHEALTH Open Session - "Let’s talk about health and the role of standards for the technology”ETSI Events:  ETSI F5G Open Session on "F6G: Defining the Foundations of the Next Optical Network Generation"ETSI Events:  ESTIMED Hackathon #1 - Enabling innovative IoT-edge use cases through standardization, open-source technology, and collaboration ETSI Events:  ISAC Channel Modelling: A stepping stone in the journey to ISAC standardisationETSI Events:  5th FRMCS PlugtestsISO/IEC JTC1/SC7:  ISO/IEC/IEEE FDIS 24748-4 - Systems and software engineering — Life cycle management — Part 4: Systems engineering management planningISO/IEC JTC1/SC7:  ISO/IEC/IEEE FDIS 24748-10 - Systems and software engineering — Life cycle management — Part 10: Guidelines for systems engineering agilityISO/IEC JTC1/SC7:  ISO/IEC/IEEE FDIS 24748-7 - Systems and software engineering — Life cycle management — Part 7: Application of systems engineering on defence programsMicrowave Journal – Aerospace & Defense channel:  ALL.SPACE Awarded €950,000 by ESA’s NAVISP ProgrammeIEEE Standards Association:  Revolutionizing Sports: The New Era of Athlete Health and Performance TrackingEASA – News feed:  EASA and ECHA strengthen cooperation with updated MoC agreementIETF Blog:  New IETF Note WellMicrowave Journal – Industry News feed:  Glass Core Substrates and Glass Interposers: New Growth Engines for Glass in Advanced Packaging for AI and HPCMicrowave Journal – Industry News feed:  New IDTechEx Report Analyzes What 6G will Bring to the World of TelecomsMicrowave Journal – Aerospace & Defense channel:  Rohde & Schwarz and TRUMPF Cooperate in Drone DefenseMicrowave Journal – Industry News feed:  Qorvo Simplifies Sub-1GHz RF Design with Wideband, High-Efficiency Power AmplifierEASA – News feed:  EASA publishes report on Sustainable Aviation Fuel scale-up, progress and pressure pointsMicrowave Journal – Industry News feed:  Signal Hound Releases the PCR4200 4-Channel Phase Coherent Receiver Now in Stock and Available to OrderMIPI Alliance:  Reimagining Embedded Audio: MIPI SWI3S Is a Game ChangerETSI Events:  OpenSlice Release 2025Q2 WebinarMicrowave Journal – Industry News feed:  New MEMS-based MultiGBASE-T1 FIUs from Pickering Ramp up Test System Bandwidth, Throughput & Operational LifeMicrowave Journal – Aerospace & Defense channel:  NXGSAT Secures €1.2M Seed Funding to Accelerate Launch of its High Speed 5G Satellite ModemISO/IEC JTC1/SC7:  ISO/IEC TS 33064:2025 - Information technology — Process assessment — Process assessment model for safety processesISO/IEC JTC1/SC7:  ISO/IEC TS 15504-10:2011 - Information technology — Process assessment — Part 10: Safety extensionEASA – News feed:  New deadline: EASA Certification Director vacancy now open until October 28Microwave Journal – Industry News feed:  Keysight Completes Acquisition of Synopsys’ Optical Solutions Group and Ansys’ PowerArtistMicrowave Journal – Industry News feed:  Indium Introduces 2026 DIY Internship Program to Empower Next-Gen Industry LeadersMicrowave Journal – Aerospace & Defense channel:  Anduril Demonstrates and Delivers C-UAS Capabilities to USNORTHCOM at Falcon Peak 25.2Microwave Journal – Aerospace & Defense channel:  Teledyne e2v Achieves Initial Qualification of 16 GB Space DDR4 MemoryMicrowave Journal – Industry News feed:  Molex Announces Agreement to Acquire Smiths InterconnectISO/IEC JTC1/SC7:  ISO/IEC 29110-5-2-1 - Systems and software engineering — Life cycle profiles for very small entities (VSEs) — Part 5-2-1: Organizational management guidelinesMicrowave Journal – Industry News feed:  Broadcom Introduces Industry’s First 800G AI Ethernet NICMicrowave Journal – Industry News feed:  Wireless Startup Movandi Secures $40M for Next-Gen Intelligent Connectivity; Opens New Office in OmanIEEE Standards Association:  How Good Is The Camera? IEEE 4001™ Gives AnswersMicrowave Journal – RFID/GPS/UWB/Location channel:  Sateliot Launches a Project with the ESA to Break GPS Dependency and Open its Satellite IoT to DefenseIETF Blog:  Previewing the updated RFC-Editor.org website at IETF 124 MontrealBluetooth SIG:  Bluetooth HVAC integration will drive commercial scalability, reduce costs, and improve operational performanceMicrowave Journal – Industry News feed:  MatrixSpace Completes $20M Series B FundingMicrowave Journal – Industry News feed:  The 2026 IEEE/JSAP Symposium on VLSI Technology & Circuits Announces Call for PapersMicrowave Journal – Industry News feed:  DDS Technology Enables Microwave Ion Control for Quantum ComputingMicrowave Journal – Industry News feed:  Rohde & Schwarz Unveils Compact MXO 3 Oscilloscopes with Four and Eight ChannelsISO/IEC JTC1/SC7:  ISO/IEC TS 30103:2015 - Software and Systems Engineering — Lifecycle Processes — Framework for Product Quality Achievement

Explore by Category

I2C Pull-Up & Rise-Time Planner

Quickly size the pull-up resistors for your I2C bus, estimate rise time, and check compliance with the I2C specification.

Sep 24, 2025

Coil Inductance Calculator (Air-Core & Rod Core Beta) - Solve L or Turns

Best-in-class coil inductance calculator for single-layer air-core solenoids, plus an experimental rod-core model. Solve for inductance or for turns, switch units, share presets, and learn theory/limits with a concise FAQ.

Sep 20, 2025

LED Resistor Calculator

Quickly calculate the required series resistor for your LED. Find the nearest standard resistor value and power dissipation to safely light up your project.

Sep 3, 2025

NE555 Timer Calculator

Calculate frequency, duty cycle, and pulse duration for 555 timer circuits in astable or monostable mode.

Sep 3, 2025

AWG ↔ mm² Converter, Ampacity & Voltage Drop (with Visualization)

Convert AWG to mm and mm², check ampacity (with bundling derating), compute voltage drop with temperature/material, and compare gauges visually. Includes exportable reference table.

Sep 1, 2025 Needs Review

RJ45 Pinout & Cable Wiring Tool

Interactive T568A/B pinout tool for creating straight-through or crossover Ethernet cables. Includes cable category guides and use-cases.

Jul 5, 2025

Interactive JTAG & SWD Pinout Guide for MCU Debugging

Find and verify JTAG and SWD pinouts instantly. Select your target connector and debugger (like ST-Link, J-Link, or Picoprobe) to get an interactive wiring diagram and prevent connection errors.

Jun 30, 2025

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Guides

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The Complete Guide to DMA (Direct Memory Access) for Microcontrollers

A practical, in-depth guide to mastering DMA on microcontrollers. From theory to hands-on examples on STM32, learn how to free your CPU and optimize your embedded applications.

Oct 14, 2025

How to wire a reliable 1 m I²C sensor

Step-by-step workflow to control capacitance, size pull-up resistors, document a harness and validate the waveforms for a long I²C run.

Sep 24, 2025

1-Wire Protocol Explained: A Guide to Timing and Waveforms

A comprehensive guide to the 1-Wire (Dallas/Maxim) bus protocol. Understand the critical timing for the master reset, slave presence-pulse, and the different bit slots for writing and reading data.

Jul 23, 2025

SD Card SPI Mode Initialization: A Detailed Guide

A comprehensive guide to the SD card power-up and initialization sequence in SPI mode. Covers the 80-clock cycle startup, CMD0, CMD8, and the critical CMD55/ACMD41 handshake for all card types (SDv1, SDv2, SDHC/SDXC).

Jul 22, 2025

JTAG TAP Controller Explained: Timing, State Machine & Practical Waveforms

A practical guide to the IEEE‑1149.1 JTAG Test‑Access‑Port (TAP) controller. Learn how TCK, TMS, TDI and TDO interact, how to step through Shift‑DR / Shift‑IR, update registers, and avoid common pitfalls when building low‑level boundary‑scan tools.

Jul 17, 2025

I2C Communication Protocol Explained: Addressing, Timing, and Design

A comprehensive guide to the I2C (Inter-Integrated Circuit) bus. Covers core signals (SCL, SDA), addressing, R/W bit, ACK/NACK, START/STOP conditions, timing diagrams, pull-up resistors, and PCB layout best practices.

Jul 16, 2025

Your Ultimate Guide to Electronics Learning Resources

Discover the best books, YouTube channels, courses, and websites to learn electronics, from beginner to advanced levels. Curated and categorized for your learning journey.

Jun 3, 2025

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