NodeLoop

Electronics Design Tools, Calculators & Guides

Hub for electronics design knowledge and tools.

Practical guides, clear reference tables, and essential utilities. Straight to the point – for and by electronics enthusiasts.

Learn more about us  ·  Share ideas

RSS

NIST – Standards news feed:  2070 Balance and Scale Calibration and UncertaintiesETSI Events:  ETSI/IQC Quantum Safe Cryptography Conference 2026ETSI Events:  Electronic Attestation of Attributes (EAA) Plugtests ETSI Events:  12th UCAAT - User Conference on Advanced Automated TestingETSI Events:  ETSI AI and Data Conference 2026ETSI Events:  Software & Standards for Smart Networks & Services 2026Microwave Journal – Industry News feed:  WBA Industry Report 2026 Finds 62% of Survey Respondents More Confident to Invest in Wi-Fi Than 12 Months AgoMicrowave Journal – Industry News feed:  UMC Licenses imec’s iSiPP300 Technology to Extend Silicon Photonics Capabilities for Next-Generation ConnectivityMicrowave Journal – Industry News feed:  CEA-Leti & STMicroelectronics’ Paper at IEDM 2025 Demonstrates Path to Fully MonolithicBluetooth SIG:  How Auracastâ„¢ broadcast audio is expanding audio streaming, and a look at the market impact it could have in 2026 and beyondMicrowave Journal – Aerospace & Defense channel:  MatrixSpace Launches Portable 360 Radarâ„¢ for Rapid, Resilient Counter-Drone Operations AnywhereMicrowave Journal – Industry News feed:  Rohde & Schwarz Presents First RF Power Sensor with 0.80 mm RF Connector for gapless DC to 150 GHz CoverageEASA – News feed:  Ana Vieira da Mata elected as new Chair of EASA Management BoardMicrowave Journal – Industry News feed:  Anritsu and HEAD Acoustics Launch Acoustic Evaluation Solution for Next-Gen Automotive Emergency Call SystemsMicrowave Journal – Aerospace & Defense channel:  Spacechips Drives Imaginative New AI-enabled Satellite ApplicationsMicrowave Journal – Industry News feed:  Kyocera and Rohde & Schwarz Demonstrate OTA Characterization of mmWave PAAM at CES 2026Microwave Journal – Industry News feed:  Richardson RFPD Introduces Guerrilla RF GaN-on-SiC HEMTs for Wideband RF ApplicationsETSI News:  ETSI’s Quantum Committee First Meeting: a Key Milestone for Global Quantum Standards ISO/IEC JTC1/SC7:  ISO/IEC/IEEE FDIS 12207 - Systems and software engineering — Software life cycle processesISO/IEC JTC1/SC7:  ISO/IEC/IEEE FDIS 26512 - Systems and software engineering — Requirements for acquirers and suppliers of information products and servicesEASA – News feed:  EASA and EUROCONTROL publish joint report on assessment of gate-to-gate CO2 emissionsMIPI Alliance:  Bangkok Wrap Up: Member Meeting #70 Advances Technical Development and Strategic GoalsMicrowave Journal – Aerospace & Defense channel:  HII Debuts GRIMM Spectrum Dominance Solution at AOC 2025 International Symposium & ConventionMicrowave Journal – Industry News feed:  Sivers Semiconductors Partners with DigiKey to Expand Global Access to Wireless Products and Evaluation KitsMicrowave Journal – Aerospace & Defense channel:  Mercury Showcases Expanding Portfolio of Electronic Warfare Capabilities at AOC 2025Microwave Journal – Industry News feed:  Keysight Introduces New Handheld Analyser Enabling 120 MHz IQ Streaming for Gap-Free Signal CaptureISO/IEC JTC1/SC7:  ISO/IEC DTS 19770-13 - Information technology — IT asset management — Part 13: Guidance on the incorporation of sustainability aspects in an IT asset management systemMicrowave Journal – Industry News feed:  UMS Unveils New GH10-10, 0.1 µm GaN TechnologyMicrowave Journal – Aerospace & Defense channel:  Aaronia Showcases Cutting-edge Technology Made in Germany at AOC 2025ISO/IEC JTC1/SC7:  ISO/IEC/IEEE DIS 42042 - Enterprise, systems and software — Reference architecturesISO/IEC JTC1/SC7:  ISO/IEC/IEEE DIS 21840 - Systems and software engineering — Guidelines for the utilization of ISO/IEC/IEEE 15288 in the context of system of systems (SoS)EASA – News feed:  EASA publishes new Revision of Easy Access Rules for Information SecurityEASA – AMC & Guidance Material feed:  AMC & GM to Part-SPA — Issue 1, Amendment 17EASA – AMC & Guidance Material feed:  AMC & GM to Part-ORO — Issue 2, Amendment 29Microwave Journal – Industry News feed:  Wireless Broadband Alliance Trials Set New Benchmark Proving up to 70% Latency Reduction with Wi-Fi QoS ManagementMicrowave Journal – Aerospace & Defense channel:  SWISSto12 Accelerates Global Momentum as Europe Races to Strengthen Satellite SovereigntyETSI Events:  The Great Telco DebateISO/IEC JTC1/SC7:  ISO/IEC/IEEE WD 26511 - Systems and software engineering — Management of information for users of systems, software, and servicesISO/IEC JTC1/SC7:  ISO/IEC/IEEE DIS 21841 - Systems and software engineering — Taxonomy of systems of systemsISO/IEC JTC1/SC7:  ISO/IEC/IEEE DIS 21839 - Systems and software engineering — System of systems (SoS) considerations in life cycle stages of a systemMicrowave Journal – Aerospace & Defense channel:  Safran Federal Systems Selected by Moog for Hercules Avionics SuiteMicrowave Journal – Industry News feed:  C-UAS RF Amplifier Module, Model 1211Microwave Journal – Industry News feed:  Filtronic Awarded NSIP Funding to Develop Next-generation 550 W Ka-Band SSPAMicrowave Journal – RFID/GPS/UWB/Location channel:  SiTime Takes on GNSS Threats, Unveiling Jamming- and Spoofing-Resilient Precision Timing SolutionMicrowave Journal – EMC/EMI channel:  Feedthrough EMC Solutions From EMIS Provide High Frequency Noise Suppression and Improved System EMI PerformanceBluetooth SIG:  New test and certification specifications for the Bluetooth® NLC to DALI GatewayMicrowave Journal – Industry News feed:  Spectrum Instrumentation Releases New Multichannel AWGs for GHz Signal GenerationMicrowave Journal – Industry News feed:  Myriota Announces General Availability for HyperPulseâ„¢Microwave Journal – Industry News feed:  SCF Report Highlights How Small Cell Innovation Can Accelerate 5G NTN Development Microwave Journal – Industry News feed:  Delft Circuits Appoints Martin Danoesastro as CEO & Announces New FinancingNIST – Standards news feed:  2070 Balance and Scale Calibration and UncertaintiesETSI Events:  ETSI/IQC Quantum Safe Cryptography Conference 2026ETSI Events:  Electronic Attestation of Attributes (EAA) Plugtests ETSI Events:  12th UCAAT - User Conference on Advanced Automated TestingETSI Events:  ETSI AI and Data Conference 2026ETSI Events:  Software & Standards for Smart Networks & Services 2026Microwave Journal – Industry News feed:  WBA Industry Report 2026 Finds 62% of Survey Respondents More Confident to Invest in Wi-Fi Than 12 Months AgoMicrowave Journal – Industry News feed:  UMC Licenses imec’s iSiPP300 Technology to Extend Silicon Photonics Capabilities for Next-Generation ConnectivityMicrowave Journal – Industry News feed:  CEA-Leti & STMicroelectronics’ Paper at IEDM 2025 Demonstrates Path to Fully MonolithicBluetooth SIG:  How Auracastâ„¢ broadcast audio is expanding audio streaming, and a look at the market impact it could have in 2026 and beyondMicrowave Journal – Aerospace & Defense channel:  MatrixSpace Launches Portable 360 Radarâ„¢ for Rapid, Resilient Counter-Drone Operations AnywhereMicrowave Journal – Industry News feed:  Rohde & Schwarz Presents First RF Power Sensor with 0.80 mm RF Connector for gapless DC to 150 GHz CoverageEASA – News feed:  Ana Vieira da Mata elected as new Chair of EASA Management BoardMicrowave Journal – Industry News feed:  Anritsu and HEAD Acoustics Launch Acoustic Evaluation Solution for Next-Gen Automotive Emergency Call SystemsMicrowave Journal – Aerospace & Defense channel:  Spacechips Drives Imaginative New AI-enabled Satellite ApplicationsMicrowave Journal – Industry News feed:  Kyocera and Rohde & Schwarz Demonstrate OTA Characterization of mmWave PAAM at CES 2026Microwave Journal – Industry News feed:  Richardson RFPD Introduces Guerrilla RF GaN-on-SiC HEMTs for Wideband RF ApplicationsETSI News:  ETSI’s Quantum Committee First Meeting: a Key Milestone for Global Quantum Standards ISO/IEC JTC1/SC7:  ISO/IEC/IEEE FDIS 12207 - Systems and software engineering — Software life cycle processesISO/IEC JTC1/SC7:  ISO/IEC/IEEE FDIS 26512 - Systems and software engineering — Requirements for acquirers and suppliers of information products and servicesEASA – News feed:  EASA and EUROCONTROL publish joint report on assessment of gate-to-gate CO2 emissionsMIPI Alliance:  Bangkok Wrap Up: Member Meeting #70 Advances Technical Development and Strategic GoalsMicrowave Journal – Aerospace & Defense channel:  HII Debuts GRIMM Spectrum Dominance Solution at AOC 2025 International Symposium & ConventionMicrowave Journal – Industry News feed:  Sivers Semiconductors Partners with DigiKey to Expand Global Access to Wireless Products and Evaluation KitsMicrowave Journal – Aerospace & Defense channel:  Mercury Showcases Expanding Portfolio of Electronic Warfare Capabilities at AOC 2025Microwave Journal – Industry News feed:  Keysight Introduces New Handheld Analyser Enabling 120 MHz IQ Streaming for Gap-Free Signal CaptureISO/IEC JTC1/SC7:  ISO/IEC DTS 19770-13 - Information technology — IT asset management — Part 13: Guidance on the incorporation of sustainability aspects in an IT asset management systemMicrowave Journal – Industry News feed:  UMS Unveils New GH10-10, 0.1 µm GaN TechnologyMicrowave Journal – Aerospace & Defense channel:  Aaronia Showcases Cutting-edge Technology Made in Germany at AOC 2025ISO/IEC JTC1/SC7:  ISO/IEC/IEEE DIS 42042 - Enterprise, systems and software — Reference architecturesISO/IEC JTC1/SC7:  ISO/IEC/IEEE DIS 21840 - Systems and software engineering — Guidelines for the utilization of ISO/IEC/IEEE 15288 in the context of system of systems (SoS)EASA – News feed:  EASA publishes new Revision of Easy Access Rules for Information SecurityEASA – AMC & Guidance Material feed:  AMC & GM to Part-SPA — Issue 1, Amendment 17EASA – AMC & Guidance Material feed:  AMC & GM to Part-ORO — Issue 2, Amendment 29Microwave Journal – Industry News feed:  Wireless Broadband Alliance Trials Set New Benchmark Proving up to 70% Latency Reduction with Wi-Fi QoS ManagementMicrowave Journal – Aerospace & Defense channel:  SWISSto12 Accelerates Global Momentum as Europe Races to Strengthen Satellite SovereigntyETSI Events:  The Great Telco DebateISO/IEC JTC1/SC7:  ISO/IEC/IEEE WD 26511 - Systems and software engineering — Management of information for users of systems, software, and servicesISO/IEC JTC1/SC7:  ISO/IEC/IEEE DIS 21841 - Systems and software engineering — Taxonomy of systems of systemsISO/IEC JTC1/SC7:  ISO/IEC/IEEE DIS 21839 - Systems and software engineering — System of systems (SoS) considerations in life cycle stages of a systemMicrowave Journal – Aerospace & Defense channel:  Safran Federal Systems Selected by Moog for Hercules Avionics SuiteMicrowave Journal – Industry News feed:  C-UAS RF Amplifier Module, Model 1211Microwave Journal – Industry News feed:  Filtronic Awarded NSIP Funding to Develop Next-generation 550 W Ka-Band SSPAMicrowave Journal – RFID/GPS/UWB/Location channel:  SiTime Takes on GNSS Threats, Unveiling Jamming- and Spoofing-Resilient Precision Timing SolutionMicrowave Journal – EMC/EMI channel:  Feedthrough EMC Solutions From EMIS Provide High Frequency Noise Suppression and Improved System EMI PerformanceBluetooth SIG:  New test and certification specifications for the Bluetooth® NLC to DALI GatewayMicrowave Journal – Industry News feed:  Spectrum Instrumentation Releases New Multichannel AWGs for GHz Signal GenerationMicrowave Journal – Industry News feed:  Myriota Announces General Availability for HyperPulseâ„¢Microwave Journal – Industry News feed:  SCF Report Highlights How Small Cell Innovation Can Accelerate 5G NTN Development Microwave Journal – Industry News feed:  Delft Circuits Appoints Martin Danoesastro as CEO & Announces New Financing

Explore by Category

Via Stitching Calculator (IPC-2221A + EMI)

Calculate optimal via stitching pattern for ground planes. Get EMI-compliant spacing (λ/20 rule) and via count based on IPC-2221A standards.

Nov 9, 2025

PCB Via Current Capacity Calculator (IPC-2221)

Calculate via current capacity and thermal properties using IPC-2221 standard. Determine how many vias you need for your power traces.

Nov 7, 2025

PCB Track Width Calculator (IPC-2221)

Calculate the minimum PCB track width for your current requirements using the IPC-2221 standard. Get instant results with resistance, voltage drop, and power dissipation calculations.

Nov 6, 2025

Crystal Load Capacitor Calculator

Calculate the perfect load capacitors for your crystal oscillator. Interactive tool for MCU clock circuits with frequency accuracy analysis and component recommendations.

Oct 31, 2025

PCB Stackup & Impedance Calculator

Design PCB stackups and calculate controlled impedance for high-speed signals. Interactive stackup builder with microstrip, stripline, and differential pair calculations.

Oct 30, 2025

I2C Pull-Up & Rise-Time Planner

Quickly size the pull-up resistors for your I2C bus, estimate rise time, and check compliance with the I2C specification.

Sep 24, 2025

Coil Inductance Calculator (Air-Core & Rod Core Beta) - Solve L or Turns

Best-in-class coil inductance calculator for single-layer air-core solenoids, plus an experimental rod-core model. Solve for inductance or for turns, switch units, share presets, and learn theory/limits with a concise FAQ.

Sep 20, 2025

View All Tools

Browse the full collection of design tools and calculators.

The Complete Guide to DMA (Direct Memory Access) for Microcontrollers

A practical, in-depth guide to mastering DMA on microcontrollers. From theory to hands-on examples on STM32, learn how to free your CPU and optimize your embedded applications.

Oct 14, 2025

How to wire a reliable 1 m I²C sensor

Step-by-step workflow to control capacitance, size pull-up resistors, document a harness and validate the waveforms for a long I²C run.

Sep 24, 2025

1-Wire Protocol Explained: A Guide to Timing and Waveforms

A comprehensive guide to the 1-Wire (Dallas/Maxim) bus protocol. Understand the critical timing for the master reset, slave presence-pulse, and the different bit slots for writing and reading data.

Jul 23, 2025

SD Card SPI Mode Initialization: A Detailed Guide

A comprehensive guide to the SD card power-up and initialization sequence in SPI mode. Covers the 80-clock cycle startup, CMD0, CMD8, and the critical CMD55/ACMD41 handshake for all card types (SDv1, SDv2, SDHC/SDXC).

Jul 22, 2025

JTAG TAP Controller Explained: Timing, State Machine & Practical Waveforms

A practical guide to the IEEE‑1149.1 JTAG Test‑Access‑Port (TAP) controller. Learn how TCK, TMS, TDI and TDO interact, how to step through Shift‑DR / Shift‑IR, update registers, and avoid common pitfalls when building low‑level boundary‑scan tools.

Jul 17, 2025

I2C Communication Protocol Explained: Addressing, Timing, and Design

A comprehensive guide to the I2C (Inter-Integrated Circuit) bus. Covers core signals (SCL, SDA), addressing, R/W bit, ACK/NACK, START/STOP conditions, timing diagrams, pull-up resistors, and PCB layout best practices.

Jul 16, 2025

Your Ultimate Guide to Electronics Learning Resources

Discover the best books, YouTube channels, courses, and websites to learn electronics, from beginner to advanced levels. Curated and categorized for your learning journey.

Jun 3, 2025

View All Guides

Explore all available guides and learning resources.